In parallel with the expansion of our existing businesses, the SAKATA INX Group is working to build new business in order to create new pillars to support the group in 2030. With reassurance and safety, convenience and comfort, maintenance of health, low-carbon society, and sustainability as strategic keywords in our new business, we are working on open innovation towards R&D and commercialization in our focus fields, represented by the four chemical fields of environment & biochemicals, energy chemicals, electronics chemicals, optochemicals.
As a specific example of this work, in the field of electronics chemicals we are working on the development of printed electronics. Printed electronics is a technology in which printing technology is used to form electronic components and circuits on a medium, and it is currently attracting attention due to the fact that it allows products themselves to be lighter and thinner than conventional methods do.
SAKATA INX is working to expand this business in collaboration with Wonder Future Corporation (WFC), which possesses solder joint technology (IH reflow technology) that uses IH (electromagnetic induction), and our affiliate SIIX Corporation, a major company in the EMS business.
IH reflow is a technology that is based on the same principle as household induction cooking equipment, and enables joint soldering where only the metal is heated locally by using IH (electromagnetic induction).
WFC’s IH reflow technology enables solder to be applied on top of films, resin, glass, and other materials that it could not previously be applied to due to their lack of heat resistance, and this means electronic components can be mounted on them.
This will increase the number of options in terms of materials, components, and mounting methods for a range of products, and we believe that it will broadly contribute to the development of new products that include flexible signage, onboard components for vehicles, IoT sensors, and wearable devices.
SAKATA INX is undertaking the development of materials to take advantage of this superb IH reflow technology. Materials we currently offer include wiring materials that can be heated by IH reflow and are compatible with flexible, low heat-resistant media such as film, resin, and paper, joining materials that can be fired at low temperatures and in short time thus enabling joining with IH reflow, and transparent insulating materials and sealing materials that have excellent electrical properties, do not require photoresists, and allow direct patterning on insulating film.
We believe that combining these will allow us to create new ideas for innovative process technology and new designs. These technologies will also enable the realization of completely new products through a fusion of the process development technology of SAKATA INX group company SIIX Corporation with its experience in mass production and implementation. The three companies are advancing collaboration with the goal of creating a value chain to create new value and building total solutions for manufacturing.
We are currently holding discussions with a range of companies, and over the past few years we have made progress in collaborations with the automobile and electronics manufacturers who are our main targets. This has led to some products being adopted, and our efforts towards commercialization are making steady progress.