In recent years, EB printing free of volatile organic compounds (VOCs) has drawn attention in the field of flexible packaging printing for those seeking to reduce CO2 emissions and improve environmental friendliness.
Here we will provide an overview of the features of EB printing and the characteristics of our "Diatone Dreamcure EB series" EB offset ink.
What is EB?
EB stands for electron beam, which is produced using a system that artificially accelerates electrons as a beam for utilization. This technology has various applications, including cross-linking reactions, printing, coating, and sterilization.
What is EB?
EB stands for electron beam, which is produced using a system that artificially accelerates electrons as a beam for utilization. This technology has various applications, including cross-linking reactions, printing, coating, and sterilization.
Features of EB offset ink
Diatone Dreamcure EB series
● Allows high-resolution, high-color reproduction printing
● Allows high-speed printing
● Free of volatile organic compounds (VOCs)
● Low odor
● Resistant to abrasion, chemicals, water, and heat
● Low migration
● Does not contain photopolymerization initiators found in UV inks
● Minimal heat damage (shrinkage) to substrates
EB curing | |
---|---|
VOCs | VOC-free |
Pot life | Good |
Odor after curing | Low |
Migration | Low |
Solvent resistance | Excellent |
Abrasion resistance | Excellent |
Adhesion | Moderate |
Shrink fit suitability | Moderate |
Nitrogen gas | Required |
Photopolymerization initiator | Not required |
Ambient temperature | Room temperature and above |
Curing time | Instantaneous |
Adjustable on/off operation output | Excellent |
Line length | Short |
Features of EB offset ink
Diatone Dreamcure EB series
● Allows high-resolution, high-color reproduction printing
● Allows high-speed printing
● Free of volatile organic compounds (VOCs)
● Low odor
● Resistant to abrasion, chemicals, water, and heat
● Low migration
● Does not contain photopolymerization initiators found in UV inks
● Minimal heat damage (shrinkage) to substrates
EB curing | |
---|---|
VOCs | VOC-free |
Pot life | Good |
Odor after curing | Low |
Migration | Low |
Solvent resistance | Excellent |
Abrasion resistance | Excellent |
Adhesion | Moderate |
Shrink fit suitability | Moderate |
Nitrogen gas | Required |
Photopolymerization initiator | Not required |
Ambient temperature | Room temperature and above |
Curing time | Instantaneous |
Adjustable on/off operation output | Excellent |
Line length | Short |