● Low temperature curable at 80℃ for 15 min.
● Fast curing in 3 seconds by combination with IH reflow equipment
● Applicable to low heat-resistant substrates, diffilcut-to-solder substrates, and low heat-resistant electronic components.
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＃Conductive ＃Conductive adhesive ＃Curable under air ＃Low temperature curing ＃Fast curing ＃Screen printing ＃Dispenser printing
Potential Applications
● Mounting on low heat-resistant substrates (FHE, MID, printed electronics, etc.)
● Mounting of low heat-resistant eletronic components (batteries, optical components, etc.)
General Properties
| Test Items | ESE006 | |||||
|---|---|---|---|---|---|---|
| Viscosity (Pa-s) | 170 | |||||
| Recommended curing conditions | 80℃× 15min |
100℃× 15min |
120℃× 15min |
150℃× 15min |
IH-reflow 3sec |
|
| Volume resistivity (Ω-cm) | 4.5×10-3 | 1.0×10-3 | 7.3×10-4 | 8.0×10-4 | － | |
| Initial bond strength (MPa) | 30 (5025chip) |
70 (5025chip) |
69 (5025chip) |
75 (5025chip) |
25 (HH-1-G) |
|
| Printing method | Screen, metal mask, dispenser | |||||
| Applicable substrates | PET / Polycarbonate / ITO, etc. | |||||
| Tg (℃) | 115 | |||||
| Storage conditions | Refrigeration (-24°C): 2 months, Room temperature (25°C): 1 month | |||||
* All values are representative.
IH Reflow
- Instantaneous heating (~10 sec.) minimizes thermal damage, enabling mounting on low heat-resistant and high heat-dissipation substrates
- Pin-point heating by focusing the magnetic flux at the nozzle reduces thermal damage to the outside of the heating target
- Non-contact heating reduces thermal damage to the heated object
- Heating profiles is controllable, resulting in suppressing splattering and voids compared to lasers
IH Reflow System : Wonder Future Corporation
Customer Application
● Connectors for current external terminal in perovskite solar cell
● FHE (Flexible Hybrid Electronics) component
● Molded Interconnect Device (MID) / Printed Electronics
Product Inquiries
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