Conductive Materials
LINEUP List of Products
Cu nanopaste for high density interconnect
(printable by gravure offset printing)
● Printable by gravure offset printing which enables fine-pitch trace down to L/S=7/12μm.
● < 10-5 Ω-cm order volume resistivity of at <150℃ by using formic acid reflow oven.
Solderable conductive paste
● One-component epoxy conductive paste
● Screen printing and dispenser printing available
● Compatible with conventional soldering reflow processes
● Excellent adhesion to various substrates such as PI and PET
● Excellent flexibility
Low temperature, fast curing conductive adhesive
(80℃ for 15 min~ or IH for 3 sec~)
● Low temperature curable at 80℃ for 15 min.
● Fast curing in 3 seconds by combination with IH reflow equipment
● Applicable to low heat-resistant substrates, diffilcut-to-solder substrates, and low heat-resistant electronic components.
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