Low temperature sintering
Sn paste

Electronics-related development products
R&D products

● Low-temperature sintering at 160℃ in air
● Conductive as good as Ag paste
● Better reliability in high temperature and high humidity condition, and higher resistant to ion migration than Ag paste

＃Conductive paste ＃high reliability ＃migration resistance ＃conductive adhesive ＃sn ＃atmospheric sintering ＃low temperature sintering

＃Printed electronics

Potential Applications

● Conductive adhesives
● Die bonding
● Via fill
● Electromagnetic shielding
● Thermal Interface Materials (TIM)
● Electrodes of passive components

General Properties

Reference physical properties		CNE023
Viscosity (Pa-s)		100 to 250
Recommended curing conditions		160°C × 60 min in air
Volume resistivity (Ω-cm)		3.5×10^-5
Thermal conductivity (W/m-K)		21.1
Coefficient of linear expansion (ppm/K)	α1	46.6
Coefficient of linear expansion (ppm/K)	α2	133.5
Storage conditions		Refrigerated

CNE023 cured at 160℃ × 60min in air was used for evaluation
Thermal conductivity:periodic heating method, in-plane direction

*All values are representative.

▼Cross section of coating film after heating (160℃ × 60min under air)

85°C/85% environment exposure test

・ Composition: 0 Ω 5025 chip / paste / Cu foil
・ Curing condition: 160℃×60min
・ Test chamber conditions: 85℃ / 85%

▼Configuration Diagram

Water drop test

・ Trace space of comb pattern: 520-560μm
・ Curing condition: 160℃×60min
・ Test condition: 2μL of water is dropped and 2 V is applied.

Printability

developed pastes for screen printing

<Conditions>
Substrate	PET (0.1 mm thick)
Drying conditions	150℃ × 30 min
Print mask conditions	Mesh: ST325B
	Mesh wire diameter: 28μm
	Emulsion thickness: 15μm