● One-component epoxy conductive paste
● Screen printing and dispenser printing available
● Compatible with conventional soldering reflow processes
● Excellent adhesion to various substrates such as PI and PET
● Excellent flexibility
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Potential Applications
● Traces for printed electronics
● Underlayer for solder TIM (indium solder, etc.)
● Underlayer for solder die bonding
General Properties
| Test Item | CKE002 |
|---|---|
| Viscosity (Pa-s) | 90 |
| Recommended curing conditions | 150℃x 30 min or 120℃x 60 min |
| Volume resistivity (Ω-cm) | 1.2×10-4 |
| Printing method | Screen , Dispenser |
| Storage conditions | Refrigeration |
*All values are representative.
Printability
Excellent continuous printability
| <Conditions> | |
| Substrate | PET (0.1 mm thick) |
| Drying conditions | 150℃ × 30 min |
| Print mask conditions | Mesh: T300B |
| Mesh wire diameter: 34μm | |
| Emulsion thickness: 15μm |
▼Printing pattern
▼Image of printed CKE002 (x50)
Utilizes solder's self-alignment mechanism
Good solder wettability enables to take advantage of solder's self-alignment mechanism
▼SnBi solder on CKE002 traces self-aligned in reflow process (2x playback)
| <Conditions> | |
| Substrate: | Glass |
| Solder: | SnBi solder |
| Heating conditions: | Hot plate at 160℃ |
| Trace: | L/S=350μm/300μm |
Printed Electronics Prototype Examples
LED signage with temperature sensor
Customer Applicaiton
● Touch panel , etc.
Product Inquiries
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